Document Type : Research Paper
Authors
1
Ph.D., Wood Composite, Industrial Manufacturer Company, Arian Maryam, Rasht, I.R. Iran
2
M.Sc., Wood Composite, Industrial Manufacturer Company, Arian Maryam, Rasht, I.R. Iran
3
B.Sc., Electronic Eng., Industrial Manufacturer Company, Arian Maryam, Rasht, I.R. Iran
Abstract
The purpose of the present study was to investigate the effect of process variables on the physical and mechanical properties of high-density fiberboard (HDF) and to improve these properties in order to use it in the flooring of buildings. The effect of press factor on three levels (7.6, 8.3 and 9.1 s / mm), the paraffin content in three levels (0, 0.5 and 1%) and the amount of adhesive in three levels (9, 9.5 and 10%) were tested on the mechanical properties of the board, such as internal bonding strength (IB), elastic modulus (MOE) and rupture modulus (MOR), and physical properties, such as the percentage of thickness swelling of the resulting boards. The results showed that increasing of press factor improved the flexural strength, modulus of elasticity, internal bonding strength and decreased the thickness swelling of the boards. By adding paraffin, the percentage of the thickness swelling of the boards decreased, while the use of paraffin at higher levels had a negative effect on mechanical strength, in particular internal bonding strength. Also, according to the results, the mechanical and physical properties of the boards improved with increasing adhesive utilization. In this study, the RSM method was used to determine the optimal limit of the board. According to the results of the RSM method and the effect of different variables, the resulting boards with a press factor of 8.9 s/mm, paraffin and adhesive content of 0.5 and 9 percent respectively, while maintaining the resistance Mechanical and physical properties in the national standard range, were determined as the optimal level for flooring.
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