Effects of Relative Humidity and Temperature on Creep Parameters of Medium Density Fiberboard (MDF)

Document Type : Research Paper

Authors

1 MSc. Graduate, Department of Wood and Paper Science and Technology, Faculty of Natural Resources Tarbiat Modares University, Noor, Iran

2 Associated Professor, Department of Wood and Paper Science and Technology, Faculty of Natural Resources, Tarbiat Modares University, Noor, Iran

3 Assistant Professor, Department of Wood and Paper Science and Technology, Faculty of Natural Resources, Tarbiat Modares University, Noor, Iran

Abstract

In this research, creep behavior of medium density fiber board (MDF) under different conditions (different relative humidity and different temperature) was investigated. For this purpose, flexural creep tests at 15% and 30% of ultimate bending load were performed by using flexural creep equipment. The samples underwent under load at relative humidity of 45, 65 and 85% and temperatures of 15, 23 and 30°C for 72 hours. The results showed that relative creep and total creep of the samples increase with increasing temperature and relative humidity, while the creep modulus decreases with increasing temperature and relative humidity. The greater changes were obtained at higher relative humidity and temperature an also at higher load level. The results also showed that the relative creep is more sensitive to relative humidity compared to temperature. Conversely creep modulus is more sensitive to temperature compared to relative humidity that greater changes have been observed in higher load level.

Keywords


[1]. Mostafazadeh Marzenaki, M., KazemiNajafi, S., Chaharmahali, M., and Hajihassani, R. (2009). Study behavior creep composites made mixes particle board and medium density Fiber Board-Recycled from HDPE waste and effect water fiber board absorption on Composites. Journal of Wood and Paper Science Research, 24(2): 194-205.
[2]. Doosthoseini, K. (2001). Textbook of Wood Composite Materials, University of Tehran Press, Tehran.
[3]. Dunky, M. (1998). Urea–formaldehyde (UF) adhesive resins for wood. International Journal of Adhesion and Adhesives, 18(2): 95-107.
[4]. Salthammer, T., Mentese, S., and Marutzky, R. (2010). Formaldehyde in the indoor environment. Chemical Reviews, 110(4): 2536.
[5]. Nikrai, J., Kazemi Najafi, S., and Ebrahimi, Gh. (2010). A comparative study on creep behavior of wood flour-polypropylene composite, medium density fiberboard (MDF) and particleboard. Journal of Polymer Science and Technology, 22(5): 363-371.
[6]. Dinwoodie, J., Higgins, J.-A., Paxton, B., and Robson, D. (1992). Creep in chipboard. Wood Science and Technology, 26(6): 429-448.
[7]. Armstrong, L., and Grossman, P. (1972). The behaviour of particle board and hardboard beams during moisture cycling. Wood Science and Technology, 6(2): 128-137.
[8]. Chow, P. (1970). The deflection of composite furniture panels under constant bending stress. Forest Products Journal, 20(12): 44-51.
[9]. Chow, P. (1980). Static bending of red oak-veneered medium-density fiberboard furniture panels. International Journal of Furniture, 2(3): 25-26.
[10]. Chow, P. (1982). Bending creep behavior of Acer saccharummarsh veneered medium-density fibreboard composite. Wood Science and Technology, 16(3): 203-213.
[11]. Fernandez-Golfin, J.l., and Diez Barra, M. (1992). Long-term behavior of particleboard under variable humidity conditions. Holzforschung und Holzverweretung, 44(6): 106-110.
[12]. Halligan, A., and Schniewind, A. (1972). Effect of moisture on physical and creep properties of particleboard. Forest Products Journal, 22(4): 41-48.
[13]. Chow, P. (1979). Deflection in bending of birch-veneered wood-base composite shelving panels. Forest Products Journal, 29(12): 39-40.
[14]. Zhou, J., Hu, C., Hu, S., Yun, H., Jiang, G., and Zhang, S. (2012). Effects of temperature on the bending performance of wood-based panels. BioResources, 7(3): 3597-3606.
[15]. Ozarska, B., and Harris, G. (2007). Effect of cyclic humidity on creep behaviour of wood-based furniture panels. Electronic Journal of Polish Agricultural Universities, 10(3):1-11.
[16]. ASTM D 1037-99. (1999). Standard test methods for evaluating properties of wood-based fiber and particle panel materials. West Conshohoken, Pa. USA.
[17]. ASTM D 6815-02a. (2002). Standard specification for evaluation of duration of load and creep effects of wood and wood-based products.West Conshohoken, Pa. USA.
[18]. ISO 6602. (1985). Determination of flexural creep by three-point loading. Information Transfer and Management, pp.508.
[19]. Bodig, J., and Jayne, B. (1982). Mechanics of Wood and Wood composites. Van Nostran-Reinhold Composites, New York.
[20]. Ebewele, R.O. (2000). Polymer Science and Technology. Taylor & Francis Group, New York.
[21]. Zhou, Y., Fushitani, M., and Kamdem, D.P. (2001). Bending creep behavior of medium density fiberboard and particleboard during cyclic moisture changes. Wood and fiber Science, 33(4):609-617.
[22]. Pizzi, A. (1989). Wood Adhesives: Chemistry and Technology. Marcel Dekker Incorporated, New York.
[23]. Wiglusz, R., Sitko, E., Nikel, G., Jarnuszkiewicz, I., andIgielska, B. (2002). The effect of temperature on the emission of formaldehyde and volatile organic compounds (VOCs) from laminate flooring—case study. Building and Environment, 37(1): 41-44.