Studying Thermal Behavior and Formaldehyde Emission of Modified Urea Formaldehyde Resin by Furfural

Document Type : Research Paper

Authors

1 Graduated MSc, Department of Wood and Paper Sciences and Technology, Faculty of Natural Resources, University of Tehran, Karaj, I.R. Iran

2 Professor, Department of Wood and Paper Sciences and Technology, Faculty of Natural Resources, University of Tehran, Karaj, I.R. Iran

3 Professor, Faculty of Science, Payame Nour University Tehran, I.R. Iran

4 Associate Professor, Department of Wood and Paper Sciences and Technology, Faculty of Natural Resources, University of Tehran, Karaj, I.R. Iran

Abstract

There are adequate sources for wood adhesives, but scarcity of oil resources can affect the cost and future availability of oil based resins. For avoiding of this process, seeking for feasibility of replacement of these oil feedstocks is necessary. In present work, thermal behavior of urea formaldehyde resin modified by furfural was investigated. The thermo-gravimetry was used for this purpose, and FTIR spectroscopy also was used to determine the functional groups in adhesives. In this study, three types of resins including industrial urea formaldehyde, and urea formaldehyde furfural in 25% and 50% of formaldehyde replacement by furfural were considered as variables. The formaldehyde emission from manufactured particle-board also was measured. Results of thermal studying of adhesives indicated that resin modification had improving influence on thermal properties of resin, especially in higher temperatures (around 220-380˚C). Obtained FTIR spectrums also revealed the much similarity between groups and bonds of industrial resin and modified resins. Modification of resin by furfural reduced the formaldehyde emission of particleboard to E1 level.

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[1]. Prasittisopin, L., and Li, K. (2010). A new method of making particleboard with a formaldehyde-free soy-based adhesive. Composites: Part A, 41(10):1447-1453.
[2]. Jang, Y.W., Huang, J., and Li, K. (2011). A new formaldehyde-free wood adhesive from renewable materials. International Journal of Adhesion and Adhesives, 31(7):754-759.
[3]. Pizzi, A., and Mittal, K.L. (2003). Handbook of Adhesive Technology, CRC Press, New York.
[4]. Pizzi, A. (1994). Advanced Wood Adhesives Technology, CRC Press, New York.
[5]. Conner, H.A. (1996). Urea-formaldehyde adhesive resin. In: Joseph, C., Salamone, J., Clapol, D.A., and Aller M. (ed.). Encyclopedia of Polymer Material, 2:8495-500.
[6]. Siimer, K., Kaljuvee, T., Pehk, T., and Lasn, I. (2010). Thermal behavior of melamine-modified urea-formaldehyde resins. Journal of Thermal Analysis and Calorimetry, 99(3):755-762.
[7]. Salem, M.Z.M., Bohm, M., Berankova, J., and Srba, J. (2011). Effect of some manufacturing variables on formaldehyde release from particleboard: relationship between different test methods. Building and Environment, 46(10):1946-1953.
[8]. Schneider, M.H., and Phillips, J.G. (2010). Furfural-urea resins and adhesives and their methods of production. Patent no.: US 7,781,521 B2.
[9]. Tin Win, D. (2005). Furfural Gold from Garbage. Faculty of Science and Technology, Assumption University Banykok, Thailand, 8(4): 185-190.
[10]. Roumeli, E., Papadopoulou, E., Pavlidou, E., Vourlias, G., Bikiaris, D., Paraskevopoulos, K.M., and Chrissafis, K. (2012). Synthesis, characterization and thermal analysis of urea-formaldehyde/nano SiO2 resins. Thermochimica Acta, 527:33-39.
[11]. Pan, Z., Cathcart, A., and Wang, D. (2005). Thermal and chemical treatments to improve adhesive property of rice bran. Industrial Crops and Products, 22(3):233-240.
[12]. Jiang, X., Li, C., Chi, Y., and Yan, J. (2010). TG- FTIR study on urea-formaldehyde resin residue during pyrolysis and combustion. Journal of Hazardous Materials, 173(1):205-210.
[13]. Siimer, K., Christjanson, P., Kaljuvee, T., Pehk, T., Lasn, I., and Saks, I. (2008). TG-DTA study of melamin-urea-formaldehyde resins. Journal of Thermal Analysis and Calorimetry, 92(1):19-27.
[14]. Wang, Zh., Li, Zh., Gu, Zh., Hong, Y., and Cheng, L. (2012). Preparation, characterization and properties of starch-based wood adhesive. Carbohydrate Polymers, 88(2):699-706.
[15]. Liu, Y., and Li, K. (2007). Development and characterization of adhesives from soy protein for bonding wood. International Journal of Adhesion & Adhesives, 27(1):59-67.
[16]. JIS. Standard Test Methods for evaluation formaldehyde emission from particleboards, JIS A 5908: UDC 691.14-413:674.817, 1994.
[17]. Zorba, T., Papadopoulou, E., Hatjiissaak, A., Paraskevopoulos, K.M., and Chrissafis, K. (2008). Urea-formaldehyde resins characterized by thermal analysis and FTIR method. Journal of Thermal Analysis and Calorimetry, 92(1): 29-33.
[18]. Pizzi, A. (1990). Furfural-enhanced formaldehyde emission from UF particleboard. Holz Roh Werkst, 48(10): 376.